|
HS Code |
929112 |
| Chemical Name | p-Hydroxystyrene Copolymer Resin |
| Appearance | White to light yellow solid |
| Molecular Formula | (C8H8O)n |
| Average Molecular Weight | Varies (typically 10,000–100,000 g/mol) |
| Glass Transition Temperature | Approximately 140°C |
| Solubility | Soluble in organic solvents such as ethanol and acetone |
| Density | 1.09–1.13 g/cm³ |
| Purity | ≥ 98% |
| Melting Point | No sharp melting point; softens at elevated temperatures |
| Storage Conditions | Keep in a cool, dry place away from direct sunlight |
| Cas Number | 25750-89-0 |
| Main Uses | Photoresists, electronic materials, specialty coatings |
| Structure Type | Amorphous thermoplastic resin |
| Refractive Index | 1.58–1.61 |
| Moisture Content | < 0.5% |
As an accredited p-Hydroxystyrene Copolymer Resin factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied in a sealed 25 kg fiber drum with inner polyethylene lining, the p-Hydroxystyrene Copolymer Resin is clearly labeled. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL) for p-Hydroxystyrene Copolymer Resin: Typically 8–10 metric tons, packed in 25 kg bags on pallets for optimal transport. |
| Shipping | **Shipping Description for p-Hydroxystyrene Copolymer Resin:** p-Hydroxystyrene Copolymer Resin is typically shipped in sealed, moisture-proof drums or bags to prevent contamination and degradation. It should be protected from heat and sunlight, with transport under cool, dry conditions. Ensure compliance with chemical transport regulations and provide proper labeling and safety documentation during shipping. |
| Storage | **p-Hydroxystyrene Copolymer Resin** should be stored in a tightly sealed container in a cool, dry, and well-ventilated area, away from direct sunlight, heat sources, and moisture. Keep it separated from strong oxidizing agents and acids. Avoid exposure to humidity and temperature extremes to maintain product integrity. Follow all local regulations and safety guidelines for chemical storage. |
| Shelf Life | p-Hydroxystyrene Copolymer Resin typically has a shelf life of 12 months when stored in a cool, dry, and sealed container. |
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Purity 99%: p-Hydroxystyrene Copolymer Resin with purity 99% is used in advanced photoresist formulations, where it enhances pattern resolution and minimizes impurities. Molecular weight 30,000: p-Hydroxystyrene Copolymer Resin with a molecular weight of 30,000 is used in semiconductor lithography, where it provides optimal film formation and process stability. Viscosity grade 5,000 cps: p-Hydroxystyrene Copolymer Resin of viscosity grade 5,000 cps is used in specialty coatings, where it ensures uniform application and excellent leveling properties. Particle size 1 micron: p-Hydroxystyrene Copolymer Resin with particle size of 1 micron is used in microelectronic encapsulation, where it achieves smooth surface finishes and low defect rates. Melting point 220°C: p-Hydroxystyrene Copolymer Resin with melting point 220°C is used in high-temperature adhesives, where it delivers reliable thermal resistance and sustained adhesion strength. Glass transition temperature 125°C: p-Hydroxystyrene Copolymer Resin with glass transition temperature of 125°C is used in optical grade plastics, where it provides dimensional stability and clarity under varying conditions. Stability temperature 200°C: p-Hydroxystyrene Copolymer Resin with stability temperature of 200°C is used in electronic component coatings, where it maintains integrity and performance during soldering processes. Hydroxyl content 15%: p-Hydroxystyrene Copolymer Resin with hydroxyl content of 15% is used in functionalized polymer blends, where it enables superior crosslinking and enhanced mechanical strength. Acid value <2 mg KOH/g: p-Hydroxystyrene Copolymer Resin with acid value less than 2 mg KOH/g is used in precision molding applications, where it prevents unwanted side reactions and ensures product purity. Moisture content <0.1%: p-Hydroxystyrene Copolymer Resin with moisture content less than 0.1% is used in moisture-sensitive electronic packaging, where it reduces risk of conductivity and degradation. |
Competitive p-Hydroxystyrene Copolymer Resin prices that fit your budget—flexible terms and customized quotes for every order.
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Every day on our production floor, small changes deliver noticeable results. The right resin changes formulations, boosts stability, and brings a new kind of flexibility to demanding environments. Our p-Hydroxystyrene copolymer resin introduces exactly that—a robust organic backbone, shaped with the needs of today’s electronics, coatings, and adhesives industries in mind. Specialists on our team know the quirks of this material first-hand, from the subtle variations in polymer chain length to the distinct advantages these features bring inside technical formulas. We see the performance under lab lights and in the hands of end users pushing reliability and consistency, job after job.
Across hundreds of production batches, direct customer feedback confirmed what we’ve seen at the bench: a lot happens at the microscopic level. Unlike generic polystyrene resins, p-Hydroxystyrene copolymers include phenolic hydroxyl groups along the backbone. This change doesn’t just shift a spec—it influences glass transition temperature and reactivity. The additional functionality means stronger hydrogen bonding, improved adhesion, and greater compatibility when crosslinking with epoxy or melamine systems. Our operators build every grade to match the close tolerances demanded in photolithographic applications, advanced adhesives, and protective coatings.
Since our early runs with homopolymer p-Hydroxystyrene, plenty of clients asked for more temperature resistance or better solubility in common solvents. Sometimes, the challenge arrived from a fabrication engineer striving for sharper resolution on a printed circuit board. Other times, a processor in the optical film business needed higher purity, above what commodity styrenics offer. Through early morning discussions and repeated pilot plant trials, we adapted our copolymerization techniques. Interfacial polymerization at controlled temperatures delivers excellent molecular weight distribution and tailors the final product’s ratio of hydroxystyrene to comonomer. We don’t simply meet a listed specification; the work happens here, batch by batch, based directly on the specific requirements you share and our own long-term process improvements.
People often ask about the kinds of comonomers we introduce in our resin. Drawing on our experience, we often turn to para-methylstyrene for higher softening points or alpha-methylstyrene to fine-tune thermomechanical behavior. By altering feed ratios and reaction conditions, our team strengthens resistance to yellowing, improves flow during thermal processing, or balances hydrophilicity and hydrophobicity for precise applications. We don’t just read this in journals—we see the difference reflected in cleaner photoresist lines or peel tests in adhesive multilayers.
In the lab and out on the line, technical personnel focus on essential performance markers. Our high-purity p-Hydroxystyrene copolymer resin runs consistently with molecular weights from 18,000 to 50,000 g/mol, depending on the comonomer blend and application target. Particle size, softness, and purity matter a lot for flow and curing behavior. Labs test for residual monomer, ash content, and trace metals. Customers from the electronics sector share that low ionic contamination—less than 10 ppm for sodium and potassium—keeps their circuit patterns sharp and free of electrical leakage.
On our floor, we keep a close eye on moisture absorption and dust formation. Fine, free-flowing powders speed up dispersion in solvent-based systems, making our resin not just a recipe component, but a reliable partner in fast-paced production settings. As we scale up, we rely on in-house extrusion, filtration, and packaging lines to reduce contamination risk. Clean hoppers, proper nitrogen blanketing, and weekly audits reflect the pride our crew takes in each kilo leaving the factory.
Photoresist formulators bring this material to their development benches because the phenolic-OH groups react cleanly with formaldehyde and crosslinkers, building the strength needed for complex microelectronic fabrication. These groups also raise the sensitivity to acid or base catalyzed reactions in chemical amplification systems. Down the line, our resin lays the groundwork for precision pattern transfer—masking, insulating, or bonding intricate layers on silicon wafers.
Adhesive producers and industrial painters rely on the resin’s adaptability. In solvent-borne adhesives, the resin dissolves fast in polar solvents such as NMP (N-methyl-2-pyrrolidone) or DMF (dimethylformamide), keeping production lines moving. Even when ambient humidity shifts, the final films dry hard yet remain slightly flexible, avoiding the cracks that ruin expensive parts. Our polymers’ higher reactivity compared to straight polystyrene enables aggressive crosslinking, strengthening joint durability between differing substrates—think glass to plastic, or metal to fiber-reinforced composites.
In the world of coatings, processors appreciate the resin’s fast wet-out and smooth finish. Glass transition temperatures from 180°C to 220°C, depending on exact formulation, let the cured product resist deformation in high-temperature automotive or electronics settings. Before every new commercial batch, customers send their own test blend back for verification in our pilot-scale reactors. These two-way conversations fine-tune melt flow and ensure finished goods match expectations. Cured films display improved mar- and chemical-resistance, living up to the promise we set in our initial trials.
Some sites sell basic p-Hydroxystyrene, often as an academic reference material or a base for small-batch experiments. Our copolymer models, such as the PHS-30M and PHS-40LV series, target real-world production. Whether you are running large rolls of flexible circuit board substrate or coating miles of fiber optics, you benefit from tight molecular weight distribution, low color, and repeatable thermal properties. We custom-formulate with customer input, working side by side to adapt features. No one size fits all here—each iteration grows from open collaboration and a drive for stable, trouble-free runs.
We know the industry tends to lump resins under broad labels: “styrenic,” “phenolic,” or “acrylic.” But p-Hydroxystyrene copolymer resins step out of those buckets. The core hydroxyl chemistry frequently delivers higher chemical reactivity than their polystyrene relatives. With tailored comonomer content, our resin remains soluble where some polyvinylphenols gum up or refuse to disperse. Also, we invest in multi-stage purification steps so that end-users can avoid unpredictable results from contaminant spikes or batch-to-batch variation. We see these details reflected in fewer customer returns and more repeat orders.
By spending thousands of hours in formulation and process review meetings, we’ve found that differences between resin brands often don’t show up on a basic spec sheet. Our continuous reactor trains and advanced blending ensure batch consistency. Some customers have shifted away from unmodified phenolic resins because those absorbed water and swelled after exposure to atmosphere. We solved this by managing hydroxyl content tightly, double-checking glass transition and storage stability under real shop conditions. These days, our resin ships globally for electronics, composites, and specialty ink clients who care about both performance and predictability.
Certain performance requirements always rise to the surface in technical conversations: higher thermal stability for next-generation device assembly, less outgassing during high-vacuum processing, faster curing for throughput demands. Over the years, we responded by adjusting feedstocks and improving our reactor’s pressure control. Investment in real-time analytical chemistry led us to establish robust standards for trace ion removal and color protection. Instead of chasing low costs with low-grade ingredients, we focus on long-term cost control through fewer line stoppages and reduced scrap rates due to property drift.
Environmental considerations also shape our decisions. Many customers face strict limits on volatile organic compound emissions. By working with harder, higher molecular weight fractions and minimizing the need for aggressive solvents, users see less evaporation and better workplace safety. We often invite technical partners to our site to audit our environmental controls, including water treatment loops and closed transfer systems. Our experience shows that openly sharing this knowledge reassures both procurement officers and regulatory teams.
Much of what sets our material apart comes from customer-led tweaks and feedback. One automotive supplier approached us after struggling with surface defects in a clear lens coating for headlamps. We collaborated over weeks of test panels, adjusting the copolymer ratio to suppress micro-bubble formation under UV cure. Engineers from another division needed resin with extremely low potassium content, critical for photomask yields in chip fabrication. Their input led us to install new filtration steps, resulting in measurable yield increases downstream. These conversations and ongoing tests shape every product iteration.
Every year, more electronics manufacturers call for advanced lithographic performance. With feature sizes shrinking and device complexity rising, even small amounts of ionic contamination or molecular weight drift lead to failure in final goods. We stay ahead by using fresh monomers, carefully monitored reaction kinetics, and post-polymerization purification. One microelectronics customer ran a test batch comparing our PHS-40LV resin to a traditional hydrocarbon-based resin. After hundreds of silicon wafer exposures, their team logged sharper pattern edges, less delamination, and no visible haze in cured layers.
We also respond to changing adhesive technologies. Recent trends push for greener alternatives and lower processing temperatures. To meet this, we tuned the copolymer ratio and introduced renewable feedstock options where feasible. A major bonding manufacturer reported faster line speeds and fewer rejections after adopting our upgraded resin, noting that its lower VOC content also passed strict emissions checks.
Our approach to p-Hydroxystyrene copolymer resin development always begins by listening—talking directly with process engineers, R&D chemists, and plant supervisors at customer sites. Shared frustration over purity issues or batch variability pushed us to invest in more sophisticated process controls. Cross-functional teams from our quality, production, and logistics departments keep feedback front and center during weekly reviews.
Instead of chasing every new trend, we double down on what makes our material dependable—predictable cure rates, lot-to-lot color stability, and mechanical consistency through the toughest manufacturing cycles. We prefer to under-promise and over-deliver. Over the past five years, our resin grades enabled higher-yielding photomasks, more durable optical adhesives, and specialty coatings that stand up to harsh test protocols in electronics and automotive settings. Most new product launches grow out of small-scale trials, refined directly with customer data. The relationship is reciprocal—customers bring us real challenges, and we bring them the cumulative knowledge from decades of polymer synthesis and upstream chemical control.
At the bench, our chemists pay special attention to the health and safety profile of every new batch. Lower residual monomer content leads to less user exposure during compounding and handling. Advanced containment and dust control also support cleaner, safer plants for both our operators and clients’ teams. These improvements don’t add visible features to the resin, but the value becomes clear on the shop floor, where uptime rises and teams report fewer process disruptions.
For us, making p-Hydroxystyrene copolymer resin isn’t just about chemistry—it’s about pushing past the limits of what high-value manufacturing can achieve. The lessons come as much from setbacks as from successful runs. We share our knowledge base with university labs, industry conferences, and customer training sessions. That way, the learning doesn’t stop at our loading dock; it travels with every drum and bag out the door.
We challenge ourselves to track the resin’s performance long after shipment, offering onsite support and return data requests. Whether a client discovers new ways to push line speeds or uncovers an issue with thermal expansion, our team circles back to tweak and improve. Not every batch arrives perfect, but the willingness to support a client’s process, chase root causes, and solve issues together sets the standard higher across the whole sector.
Technical value—reproducibility, high purity, consistent cure—comes from continuous investment, close relationships, and hands-on expertise. We invest in new equipment, shared learning, and clear communication, always focused on supporting both simple and challenging technical agendas. p-Hydroxystyrene copolymer resin, when prepared with attention, experience, and openness, helps create tomorrow’s flexible electronics, advanced optics, and rugged adhesives. Our promise to every customer is straightforward: you bring us your toughest application requirements, and we will keep building solutions that work where and how you need them.